Non-cytotoxic according to manufacturer IFU
Products
Vashe® Solution is intended for use in cleansing, irrigating, moistening and debriding acute wounds, chronic wounds and non-intact skin. Non-cytotoxic and rigorously safety tested.
Bionix AlphaCleanse™ Antimicrobial Wound Care System is an integrated system designed for the irrigation, cleansing, and mechanical debridement of dermal wounds in addition to moistening and lubricating absorbent wound dressings.
AMERIGEL® Saline Wound Wash sprays at any angle to cleanse wounds without burning or stinging. Clinically appropriate pressure assists in removing debris and bacterial contaminants. Sterile. Drug-, additive-, and preservative-free.
Anasept Antimicrobial Skin & Wound Cleanser is a clear, isotonic liquid that helps in the mechanical removal of the debris and foreign material from the application site.
BerbereX® Wound Cleanser is a safe and non-irritating antimicrobial wound cleanser that has broad-spectrum antimicrobial properties. Patented formulation resolves pathogenic flora and helps to decolonize the wound.
BioClense™ is a surfactant- and polymer-based wound cleanser that removes debris and bioburden in the wound bed for optimal wound bed hygiene.
Dakin's Solution® Quarter Strength is a broad-spectrum antimicrobial cleanser that is gentle to the skin. Effective against MRSA, VRE, other bacteria, viruses, molds, fungi, and yeast. Also used for odor control.
Dakin's Wound Cleanser is the same non-cytotoxic, low-foaming formulation as Di-Dak-Sol (Diluted Dakin's Solution). It mechanically cleanses acute and chronic wounds, stage 1–4 pressure injuries, diabetic foot ulcers, and burns.
Dakin's Wound Cleanser Pro is the same non-cytotoxic formulation as Dakin's Solution Quarter Strength. It mechanically cleanses acute and chronic wounds, stage 1–4 pressure injuries, diabetic foot ulcers, and burns.
DermaGran® Wound Cleanser With Zinc is a gentle skin and wound cleanser that contains both zinc and vitamin B6. Helps to cleanse and prepare the wound bed for healing.